====== disco ======

{{ map-disco.svg?100|NanoLab map showing disco location}}

[[https://docs.google.com/document/d/1ffHzOmxqdKiSMt3FAk8orN4R7tDa1K2OtkEQViS28_o/edit?usp=sharing|NanoLab disco manual]]

disco is a wafer dicing saw. We have used it to dice glass wafers but have had trouble dicing MEMS devices without breaking them.

===== Process Notes =====

^ Date ^ Person ^ Data ^
| 16 Sep 2020 | Daniel | Glass cutting blade cracks 0.7mm thick borofloat wafer and runs into chuck (bad!) at the current nanolab-manual-recommended speed of 1mm/s. Cuts at 0.25mm/s work much better. |
| 24 Jun 2021 | Daniel | Glass cutting blade can cut a 0.7um thick 150mm fused silica wafer with speed at least 0.35mm/s at about 10 minutes per cut across the wafer diameter, and nanolab user manual gives revised 0.5mm/s max speed with possibility of chipped edges. |