====== picotrack1/2 ======

{{ map-picotrack.svg?100|NanoLab map showing picotrack location}}

[[https://docs.google.com/document/d/1x8t7xCO1mR6KWDcxWmSaGyj49S-OSsf7zoBz-N-2TQU/edit?usp=sharing|NanoLab picotrack1 manual]]
[[https://docs.google.com/document/d/1Ohl0zjKcWCVnZ4EU_cgVMWwOc3QKVLdS4YE4UJjOL9o/edit?usp=sharing|NanoLab picotrack2 manual]]

picotrack1 and picotrack2 are robotic photoresist application and development tools. Using these is the preferred photoresist deposition method for 6" wafers and standard photoresists (svgcoat/dev6 are often used as a backup, and headway is used for other substrate sizes or specialty photoresists). Each can apply photoresist automatically on a full cassette of wafers.

===== Process Notes =====

^ Date ^ Person ^ Data ^
| 20 Aug 2020 | Daniel | It is recommended to disable TEBR (top edge bead removal) for photoresist indended as sts2 masks so the DRIE etch doesn't etch the edge of the wafer. I also like to disable TEBR for metal evaporation + liftoff to prevent metal evaporation onto wafer edges. |