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====== Wafer Ordering ======
In the past, we've ordered custom SOI wafers 25 at a time from Silicon Valley Microelectronics ([[https://svmi.com/|https://svmi.com/]]) with the following specifications:
Device Layer:
Diameter: 150mm ±0.5mm
Thickness: 40um ±1um
Type/Dopant: P/Boron
Device Resistivity: 15-25 ohm-cm
Crystal Orientation: <100> ±0.5 degree
Front Side Finish: Polished
Primary Flat Orientation: <110> ± 1 degree
BOX:
Thickness: 2um ±0.1um
Handle Layer:
Resistivity: 15-25 ohm-cm
Thickness: 550 ± 15um
Back Surface: Etched (or Polished) with oxide
Crystal Orientation: <100> ±5 degree or better
Primary Flat Orientation: <110> ± 5 degree or better
Back side finish: no oxide