asap-liftoff automatically dissolves and removes photoresist and any metals deposited on top to complete a liftoff process. We often use it while patterning gold.
| Date | Person | Data |
|---|---|---|
| 10 Sep 2020 | Daniel | Recipe 17 (high intensity 6“ wafer with soak) appears to work fine for Cr + Au liftoff with standard 2um MiR701. |
| 10 Dec 2020 | Daniel | Accidentally UV hard baked standard 2um MiR701 with axcelis recipe U for 30nm Cr + 280nm Au liftoff. Had to run recipe 17 (high intensity 6” wafer with soak) 13 times (!) to complete liftoff, but it worked in the end. |
| 12 Jul 2021 | Daniel | Recipe 14 (low intensity 6“ wafer with soak) is sufficient to liftoff 2um MiR701 with 11nm Ti, 70nm Pt. |
| 6 Nov 2021 | Daniel | Recipe 13 (6” wafer, lowest pressure, soak) used to successfully liftoff 2um MiR701 with 20nm Ti, 80nm Pt, but the metal peels away in some places, perhaps due to lack of descum before metal evaporation? |
| 6 Nov 2021 | Daniel | Recipe 1 (6“ wafer, lowest pressure, no soak) is sufficient to liftoff 2um MiR701 with 200nm Cr, 100nm Au. |