disco is a wafer dicing saw. We have used it to dice glass wafers but have had trouble dicing MEMS devices without breaking them.
| Date | Person | Data |
|---|---|---|
| 16 Sep 2020 | Daniel | Glass cutting blade cracks 0.7mm thick borofloat wafer and runs into chuck (bad!) at the current nanolab-manual-recommended speed of 1mm/s. Cuts at 0.25mm/s work much better. |
| 24 Jun 2021 | Daniel | Glass cutting blade can cut a 0.7um thick 150mm fused silica wafer with speed at least 0.35mm/s at about 10 minutes per cut across the wafer diameter, and nanolab user manual gives revised 0.5mm/s max speed with possibility of chipped edges. |