This shows you the differences between two versions of the page.
Both sides previous revision Previous revision Next revision | Previous revision | ||
nanolab [2021/02/10 00:24] dteal |
nanolab [2021/11/21 17:45] (current) dteal |
||
---|---|---|---|
Line 8: | Line 8: | ||
* [[asap-liftoff|asap-liftoff automatic liftoff tool]] | * [[asap-liftoff|asap-liftoff automatic liftoff tool]] | ||
+ | * [[ast-sputter|ast-sputter sputterer]] | ||
* [[axcelis|axcelis UV hardbake oven]] | * [[axcelis|axcelis UV hardbake oven]] | ||
* [[cha|cha metal evaporator]] | * [[cha|cha metal evaporator]] | ||
* [[disco|disco dicing saw]] | * [[disco|disco dicing saw]] | ||
+ | * [[irscope|irscope microscope with IR illumination to see through Si wafers]] | ||
+ | * [[keyence|keyence microscope]] | ||
* [[mla150|mla150 maskless exposure tool]] | * [[mla150|mla150 maskless exposure tool]] | ||
+ | * [[olympus|olympus 3D confocal microscope]] | ||
* [[optical-microscopes|optical microscopes]] | * [[optical-microscopes|optical microscopes]] | ||
* [[picotrack|picotrack1/ | * [[picotrack|picotrack1/ | ||
Line 21: | Line 25: | ||
===== Recipes ===== | ===== Recipes ===== | ||
- | * [[recipe-liftoff|metal liftoff process]] | + | * [[recipe-liftoff|liftoff process]] |
- | * [[recipe-backsideetch|through-wafer | + | * [[sts2|DRIE silicon etch process |
- | * [[recipe-frontsideetch|40um | + | |
===== Equipment ===== | ===== Equipment ===== | ||
Line 29: | Line 32: | ||
* [[wafers|list of blank wafers on our group' | * [[wafers|list of blank wafers on our group' | ||
* [[masks|mask ordering information]] | * [[masks|mask ordering information]] | ||
+ | * [[wafers|wafer ordering information]] | ||
===== Processes ===== | ===== Processes ===== | ||
Line 34: | Line 38: | ||
Standard fabrication processes and design rules. | Standard fabrication processes and design rules. | ||
- | 550-2-40 SOI process. | + | * [[soi-process|550-2-40 SOI process]] |