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--- picotrack [2021/02/07 20:20]
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+++ picotrack [2021/07/13 22:24] (current)
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 [[https://docs.google.com/document/d/1Ohl0zjKcWCVnZ4EU_cgVMWwOc3QKVLdS4YE4UJjOL9o/edit?usp=sharing|NanoLab picotrack2 manual]]
-picotrack1 and picotrack2 are robotic photoresist application and development tools and are the preferred photoresist deposition method for 6" wafers and standard photoresists (svgcoat/dev6 are often used as a backup, and headway is used for other substrate sizes or specialty photoresists). Each can apply photoresist automatically on a full cassette of wafers.
+picotrack1 and picotrack2 are robotic photoresist application and development tools. Using these is the preferred photoresist deposition method for 6" wafers and standard photoresists (svgcoat/dev6 are often used as a backup, and headway is used for other substrate sizes or specialty photoresists). Each can apply photoresist automatically on a full cassette of wafers.
+===== Process Notes =====
+^ Date ^ Person ^ Data ^
+| 20 Aug 2020 | Daniel | It is recommended to disable TEBR (top edge bead removal) for photoresist indended as sts2 masks so the DRIE etch doesn't etch the edge of the wafer. I also like to disable TEBR for metal evaporation + liftoff to prevent metal evaporation onto wafer edges. |

Berkeley Autonomous Microsystems Lab