Differences

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--- primaxx [2021/02/09 23:47]
dteal
+++ primaxx [2021/12/03 01:23] (current)
dteal [Process Notes]
@@ Line 5: / Line 5: @@
 [[https://docs.google.com/document/d/1HrWAXNa7P8gIGWwhzTrYoYCvWThcm8Cl9GVnIBhR5Qo/edit?usp=sharing|NanoLab primaxx manual]]
-primaxx is an HF vapor etching tool. We use it to remove SiO2 from MEMS devices without stiction issues caused by using a liquid etch.
+primaxx is an HF vapor etching tool. We use it to remove SiO2 from MEMS devices without the stiction issues caused by using a liquid etch.
 {{primaxx.jpg?0x200 |picture of primaxx tool}}
@@ Line 12: / Line 12: @@
 ^ Date ^ Person ^ Data ^
-| 3 Feb 2021 | Daniel | Measurements imply RECIPE5 etches somewhere around 0.1um/s (the manual claims 0.13um/s). We need a good test structure to measure this: we suspect our previous SOI-based structure didn't account for SOI footing and gave misleading data. |
+| 3 Feb 2021 | Daniel | Using RECIPE5 (the fastest etch available; I don't see a need for a slower one here) to release SOI structures. Vary etch time as desired for given etch distance (and the tool manual recommends etch cycles of at least 5 minutes each and ideally around 10; run as many cycles as need be to achieve total etch time). Measurements imply RECIPE5 etches somewhere around 0.1um/s (the manual claims 0.13um/s, which agrees). We need a good test structure to measure this: our previous SOI-based structure didn't account for SOI footing, which can be significant occasionally. |

Berkeley Autonomous Microsystems Lab