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soi-process
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soi-process [2022/05/16 15:52] dteal |
soi-process [2022/05/16 16:26] (current) dteal |
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| For etch holes for the vapor HF release, we typically use 8x8um squares on a 14x14um square grid. | For etch holes for the vapor HF release, we typically use 8x8um squares on a 14x14um square grid. | ||
| - | See the [[recipe-DRIE|DRIE silicon etch page]] for current best practices. | + | See the [[sts2|sts2 DRIE silicon etch page]] for current best practices. |
| ===== Backside Silicon ===== | ===== Backside Silicon ===== | ||
soi-process.txt ยท Last modified: 2022/05/16 16:26 by dteal
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