Differences

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+====== Wafer Ordering ======
+In the past, we've ordered custom SOI wafers 25 at a time from Silicon Valley Microelectronics ([[https://svmi.com/|https://svmi.com/]]) with the following specifications:
+<code>
+Device Layer:
+    Diameter: 150mm ±0.5mm
+    Thickness: 40um ±1um
+    Type/Dopant: P/Boron
+    Device Resistivity: 15-25 ohm-cm
+    Crystal Orientation: <100> ±0.5 degree
+    Front Side Finish: Polished
+    Primary Flat Orientation: <110> ± 1 degree
+BOX:
+    Thickness: 2um ±0.1um
+Handle Layer:
+    Resistivity: 15-25 ohm-cm
+    Thickness: 550 ± 15um
+    Back Surface: Etched (or Polished) with oxide
+    Crystal Orientation: <100> ±5 degree or better
+    Primary Flat Orientation: <110> ± 5 degree or better
+    Back side finish: no oxide
+</code>

Berkeley Autonomous Microsystems Lab