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disco
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disco [2021/02/07 20:11] dteal created |
disco [2021/07/13 22:31] (current) dteal |
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| disco is a wafer dicing saw. We have used it to dice glass wafers but have had trouble dicing MEMS devices without breaking them. | disco is a wafer dicing saw. We have used it to dice glass wafers but have had trouble dicing MEMS devices without breaking them. | ||
| + | ===== Process Notes ===== | ||
| + | ^ Date ^ Person ^ Data ^ | ||
| + | | 16 Sep 2020 | Daniel | Glass cutting blade cracks 0.7mm thick borofloat wafer and runs into chuck (bad!) at the current nanolab-manual-recommended speed of 1mm/s. Cuts at 0.25mm/s work much better. | | ||
| + | | 24 Jun 2021 | Daniel | Glass cutting blade can cut a 0.7um thick 150mm fused silica wafer with speed at least 0.35mm/s at about 10 minutes per cut across the wafer diameter, and nanolab user manual gives revised 0.5mm/s max speed with possibility of chipped edges. | | ||
disco.1612757460.txt.gz · Last modified: 2021/02/07 20:11 by dteal
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