disco

disco is a wafer dicing saw. We have used it to dice glass wafers but have had trouble dicing MEMS devices without breaking them.

Process Notes

Date	Person	Data
16 Sep 2020	Daniel	Glass cutting blade cracks 0.7mm thick borofloat wafer and runs into chuck (bad!) at the current nanolab-manual-recommended speed of 1mm/s. Cuts at 0.25mm/s work much better.
24 Jun 2021	Daniel	Glass cutting blade can cut a 0.7um thick 150mm fused silica wafer with speed at least 0.35mm/s at about 10 minutes per cut across the wafer diameter, and nanolab user manual gives revised 0.5mm/s max speed with possibility of chipped edges.