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asap-liftoff
This is an old revision of the document!
asap-liftoff
asap-liftoff automatically dissolves and removes photoresist and any metals deposited on top to complete a liftoff process. We often use it while patterning gold.
Process Notes
| Date | Person | Data |
|---|---|---|
| 10 Sep 2020 | Daniel | Recipe 17 (high intensity 6“ wafer with soak) appears to work fine for Cr + Au liftoff with standard 2um MiR701. |
| 10 Dec 2020 | Daniel | Accidentally UV hard baked standard 2um MiR701 with axcelis recipe U for 26nm Cr + 282nm Au liftoff. Had to run recipe 17 (high intensity 6” wafer with soak) 13 times (!) to complete liftoff, but it worked in the end. |
| 12 Jul 2021 | Daniel | Recipe 14 (low intensity 6“ wafer with soak) is sufficient to liftoff 2um MiR701 with 11nm Ti, 70nm Pt. |
asap-liftoff.1626240008.txt.gz · Last modified: 2021/07/13 22:20 by dteal
