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mla150
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mla150
mla150 is a maskless exposure tool. It can expose photoresist to 0.6um resolution on almost any size wafer with both frontside and backside alignment. Because no mask is required, unlike traditional photolithography tools, photoresist can be exposed half an hour after designing a layout. This also allows patterning gigantic features the size of the entire wafer with micron resolution. Exposing a 6“ wafer usually takes around 1.5 hours, though this varies with exposure settings.
Process Notes
| Date | Person | Data |
|---|---|---|
| 15 Jan 2021 | Daniel | Standard 2um MiR701 on picotrack exposes best on high quality mode with 180mJ/cm2 on silicon. Don't use fast mode because it leaves streaks along the mla150 exposure lines. Exposing a full 6” wafer takes about 1.5 hours. Exposure width may vary by 0.2um across different wafers; finer characterization may reduce this uncertainty. |
| 19 Jan 2021 | Daniel | 12um AZ P4620 deposited with Wei's picotrack recipe takes about 1000mJ/cm2 on fast mode and leaves hard-to-etch film even after development. Something needs fixing. |
mla150.1612924388.txt.gz · Last modified: 2021/02/09 18:33 by dteal
