Warning: curl_exec() has been disabled for security reasons in /services/http/users/b/bamlab/wp-content/plugins/wordfence/vendor/wordfence/wf-waf/src/lib/http.php on line 360
Warning: curl_exec() has been disabled for security reasons in /services/http/users/b/bamlab/wp-content/plugins/wordfence/vendor/wordfence/wf-waf/src/lib/http.php on line 360 picotrack [Berkeley Autonomous Microsystems Lab]
picotrack1 and picotrack2 are robotic photoresist application and development tools. Using these is the preferred photoresist deposition method for 6“ wafers and standard photoresists (svgcoat/dev6 are often used as a backup, and headway is used for other substrate sizes or specialty photoresists). Each can apply photoresist automatically on a full cassette of wafers.
Process Notes
Date
Person
Data
20 Aug 2020
Daniel
It is recommended to disable TEBR (top edge bead removal) for photoresist indended as sts2 masks so the DRIE etch doesn't etch the edge of the wafer. I also like to disable TEBR for metal evaporation + liftoff to prevent metal evaporation onto wafer edges.
picotrack.txt · Last modified: 2021/07/13 22:24 by dteal